Sealant for CMOS Image Sensors

DELO Dualbond EG6290 is a new sealant for CMOS image sensors, which are often used in driver monitoring systems.

The adhesive was specially designed for the glass-on-die assembly method. The glass filter is fixed directly onto the chip, as is typical with iBGA image sensor packaging.

Compared to previous products, the material has a significantly higher Young’s modulus of 2,350 megapascals and a significantly higher adhesion value. With a glass transition temperature of more than 130 C, the adhesive exhibits mechanically consistent behavior—even at high application temperatures—and can compensate for temperature-dependent pressure changes. The material meets the requirements of the AEC-Q100 Grade 2 automotive standard.

The adhesive is applied via needle dispensing. Thanks to its high thixotropy index, narrow and high bond lines can be precisely dispensed, onto which the glass filter is then joined.

Curing takes place in two successive process steps: First, the adhesive is exposed to light with a wavelength of 365 or 400 nanometers. Then, the glass filter is fixed within a few seconds. The adhesive typically fully cures in 15 minutes at 130 C. Due to the rapid curing reaction, the matrix in the adhesive builds up quickly, which ensures the image sensor package is reliably sealed.

Both the dual-curing process and the comparatively low curing temperature help to minimize the pressure that usually occurs when bonding glass filters.

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DELO Industrial Adhesives
www.delo-adhesives.com/us