Potting Compound Resists Cracks

Designed for temperature cycling from -55 to 180 C, EC-1015HP epoxy potting compound provides significantly better crack resistance than traditional rigid epoxies. A low-viscosity encapsulant that cures with heat, the epoxy is used for large and small potting applications with fragile components. Its low coefficient of thermal expansion of 34 ppm/C keeps stresses to a minimum. It offers superior bond strength to most substrates as well as high chemical and moisture resistance.

EC-1015HP has a high thermal conductivity of 1.2 watts per meter-Kelvin with a glass transition temperature of 162 C. It is ideal for protection of electrical components with a volume resistivity of 10¹⁶ ohm-centimeter and a dielectric strength of 450 volts per mil.

This formulation can be used in densely packaged power supplies, integrated circuits, tightly packed coils and transformers without the cracking issues associated with most epoxies.

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EpoxySet Inc.
epoxysetinc.com