Designed for temperature cycling from -55 to 180 C, EC-1015HP epoxy potting compound provides significantly better crack resistance than traditional rigid epoxies. A low-viscosity encapsulant that cures with heat, the epoxy is used for large and small potting applications with fragile components. Its low coefficient of thermal expansion of 34 ppm/C keeps stresses to a minimum. It offers superior bond strength to most substrates as well as high chemical and moisture resistance.
EC-1015HP has a high thermal conductivity of 1.2 watts per meter-Kelvin with a glass transition temperature of 162 C. It is ideal for protection of electrical components with a volume resistivity of 1016 ohm-centimeter and a dielectric strength of 450 volts per mil.